Master Thesis Opportunity: NanoFlat-Metallization for radio frequency Low-Loss Devices

Om jobbet

About Huawei Sweden R&D
Founded in 1987, Huawei Technologies has grown into a global leader in telecommunications and network solutions, with innovation at the core of everything we do. Huawei established its first overseas R&D office in Sweden in 2000, and since then, we've expanded rapidly. Today, over 400 R&D engineers are pushing boundaries in Stockholm, Gothenburg, and Lund, working on groundbreaking 6G wireless systems that shape tomorrow's technology.

Join us on our journey to develop the future of tech and be a part of a team that thrives on innovation, works hard to solve the industry's biggest challenges, and collaborates with top engineers worldwide. If you're ready to contribute to world-changing advancements, we want you on board!

About the Project: Materials Research - Material Properties/Process Exploration

Department: MPE & Module Engineering Lab
With the rapid development of radio-frequency (RF) and high-frequency electronic devices toward higher operating frequencies and lower transmission losses, the surface roughness of metallic conductors has become a critical factor affecting signal integrity and energy dissipation. In particular, on common insulating substrates such as glass, ceramics, and polymers, conventional fabrication processes often struggle to simultaneously achieve ultra-low surface roughness and long-term stability of the metal films, posing a significant limitation on device performance.

Against this background, this project aims to recruit a master's student focused on achieving ultra-low surface roughness and reliable metallization on glass, ceramic, and polymer substrates. The main research objectives are:

• Surface smoothing - exploring and optimizing techniques such as chemical-mechanical polishing and plasma treatments, etc. to significantly reduce substrate surface roughness.

• Reliable metallization - developing robust, low-loss metal deposition strategies (e.g., sputtering, electroplating, seed-layer engineering) to ensure excellent electrical conductivity and strong adhesion of metal films under high-frequency operating conditions.

The outcomes of this work will provide key process support for the next generation of low-loss RF and microwave devices. This role offers a unique opportunity to collaborate closely with cutting-edge engineering teams in Sweden and Huawei's HQ in China, while also conducting hands-on research in university labs.

Timeline
Given our current project schedules, we are looking for master's students available to start in Spring 2026.

Qualifications & Skills

• Background: Master's degree in Materials Science, Radio frequency microwave, electromagnetic.

• Communication: Strong command of English, both spoken and written.

• Team & Independence: Capable of working effectively both in teams and independently.

• Commitment to Quality: High attention to detail and dedication to producing high-quality work.

• Desirable Experience: Chemical Mechanical Planarization, Metallization of Ultra-Smooth Ceramic and Glass Substrates. Familiarity with multicultural and international work settings, and experience in a lab/testing environment.

For more information regarding this opportunity, please contact:

Bo Lundblad, Lab Director of MPE & Module Engineering Lab

E-mail: bo.lundblad@huawei.com

Phone: 0739200538

Department Master Thesis Locations Stockholm